通过 PCD表面干研磨、湿研磨、钝湿研磨等对比试验 ,观察干研磨、湿研磨表面形貌 ,研究了 PCD材料研磨机理 .试验结果表明 ,干研磨去除率远大于湿研磨去除率 ,并可使 PCD表面达到镜面 ;湿研磨、钝湿研磨不能使其达到镜面 .干研磨时 ,材料的去除机理以热化学去除为主 ,基本不发生疲劳脆性去除 ;湿研磨时 ,材料去除机理以疲劳脆性去除为主 ,同时存在局部的热化学去除 The dry grinding and wet grinding surface morphology were observed by PCD surface dry grinding, wet grinding and wet grinding, and the grinding mechanism of PCD was studied.The experimental results show that the removal rate of dry grinding is much larger than the wet grinding removal rate, So that the PCD surface to mirror; wet grinding, wet grinding can not make it reach the mirror surface.While grinding, the material removal mechanism to thermochemical removal, the basic no fatigue brittle removal; wet grinding, the material removal mechanism to fatigue brittleness Removal of the main, while there is a partial thermochemical removal