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选用雾化法制备的低熔点高Sn含量的Cu-Sn50合金粉末进行热压烧结试验,利用正交试验方法研究烧结温度、保温时间和保压压力3个烧结因素的组合作用对粉末烧结性能的影响。通过对正交试验数据的极差分析、试验样品的SEM形貌和金相组织观察分析等,测得试样烧结性能的变化情况及最优试验方案。结果表明:Cu-Sn50合金粉末在烧结温度440℃、保温180 s、压力10 MPa工艺参数下各项性能较好,可作为最佳试验方案。
Selection of low melting point high temperature Cu-Sn50 alloy powder prepared by atomization method for hot-pressing sintering test, the use of orthogonal test method sintering temperature, holding time and packing pressure combination of three sintering factors on the sintering properties of the powder influences. Through the analysis of the range of orthogonal test data, the SEM morphology of the test sample and the microstructure observation and analysis, the change of the sintering property and the optimum test scheme were measured. The results show that the properties of Cu-Sn50 alloy powders are better under the conditions of 440 ℃ sintering temperature, 180s holding temperature and 10 MPa pressure, which can be used as the best experimental scheme.