集成电路向大规模、超大规模化发展,晶片尺寸越来越大,每个单元电路的铝引线数量越来越多,电极位置也日趋密集,为电路制造工艺中间测试提出了更加严格的要求。为了适应我国集成电路中测工艺发展的需要,最近,我所对 TZ—3A 型电路测试探针(即自动 The development of integrated circuits to large-scale, ultra-large-scale development, the growing size of the chip, the number of aluminum leads per unit circuit more and more, the electrode position is also increasingly intensive, for the circuit manufacturing process testing made more stringent requirements. In order to meet the needs of China’s IC testing technology development, recently, I TZ-3A-type circuit test probe (ie automatic