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形状记忆聚合物(shape memory polymer,SMP)具有超高的形状回复率、形状记忆转变温度易调节、易赋形、密度小和成本低等优点,近年来受到广泛关注。但因力学性能较差、响应方式单一等不足,严重制约了它的应用。通过复合功能性填料可有效改善SMP的力学性能、形状记忆性能、导电和导热性能、丰富SMP响应方式,以满足应用需要。介绍形状记忆聚合物复合材料(shape memory polymercomposite,SMPC)近些年的研究进展,从填料对SMP力学性能及响应方式的影响角度分别对力学增强型SMPC、电致型SMPC、磁致型SMPC和生物功能型SMPC进行论述,分析SMPC的应用前景及面临的挑战。
Shape memory polymers (SMPs) have attracted much attention in recent years because of their high shape recovery rate, easy adjustment of shape memory transition temperature, easy shaping, low density and low cost. However, due to poor mechanical properties, single response and other shortcomings, severely restricted its application. The composite functional filler can effectively improve the mechanical properties of SMP, shape memory performance, electrical and thermal conductivity, rich SMP response to meet the needs of the application. This paper introduces the research progress of shape memory polymer composite (SMPC) in recent years. From the perspectives of the effect of filler on the mechanical properties and response of SMP, the effects of mechanical enhanced SMPC, electrosensitive SMPC, magnetostrictive SMPC and Biological functional SMPC to discuss, analyze the SMPC application prospects and challenges.