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本文阐述了微电路机械结构可靠性试验在研究和评价机械结构可靠性领域中的作用;微电路在实际应用中遇到的机械应力的类型以及MIL标准和我国相应标准中机械应力试验项目的变化情况.以较大的篇幅分析了主要机械结构试验所针对的失效机理以及各试验之间的差别和相关性.举例定量计算了恒定加速度试验与芯片和基座附着强度试验对芯片所施机械应力强度的悬殊差别,最后列举了我国在这领域中急待研究解决的问题.
This paper describes the reliability of micro-circuit mechanical structure in the field of research and evaluation of the reliability of mechanical structures in the field of micro-circuit in the practical application of mechanical stress encountered in the MIL standards and China’s corresponding standard mechanical stress test project changes The paper analyzes the failure mechanisms and the differences and correlations among the tests for the main mechanical structure tests with a larger space.Examples are given to calculate the mechanical stress applied to the chip by the constant acceleration test and chip and pedestal adhesion strength test The disparity of strength, and finally enumerated the problems our country urgently needs to study and solve in this field.