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Diamond/SnAgCu composite solder bumps were prepared on Cu pad by mechanically incorporating diamond particles into Sn3.0Ag0.5Cu(SAC) solder powders,mixing with flux and reflowing at 260 ℃ for 60 s.The spreading areas of composite solder were calculated and the distributions of copper-coated diamonds were characterized.When diamond additions were below 3 wt%,the spreading area decreased with diamond additions,and the diamonds distributed mainly at the interface between solder and Cu pad;however,when additions were beyond 4 wt%,the discharge of diamond particle occurred,and the spreading area increased due to the reduction of surface energy.
Diamond / SnAgCu composite solder bumps were prepared on Cu pad by mechanically incorporating diamond particles into Sn3.0Ag0.5Cu (SAC) solder powders, with flux and reflowing at 260 ° C for 60 s. The spreading areas of composite solder were calculated and the distributions of copper-coated diamonds were characterized. When diamond additions were below 3 wt%, the spreading area decreased with diamond additions, and the diamonds distributed primarily at the interface between solder and Cu pad; however, when additions were beyond 4 wt% the discharge of diamond particle occurred, and the spreading area increased due to the reduction of surface energy.