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随着科研和生产的不断发展,制作亚毫微秒的超高速计算机已成为人们日益关切的研究课题。众所周知,现代计算机速度进一步提高的关键在于制作高速逻辑器件、高速存贮器件,以及信号能多快地从一个电路传输到另一个电路。采用半导体技术来解决这些问题遇到了越来越大的困难,因为半导体器件的开关速度是和功耗成正比的,要提高速度势必增加功耗;功耗增大后,不仅带来了散热问题,而且由于无法进行高密度集成,信号传输延迟的影响变得十分突出。
With the continuous development of scientific research and production, the fabrication of ultra-fast computers at sub-nanoseconds has become a subject of increasing concern. It is well known that the key to further speeding up of modern computers lies in the fabrication of high-speed logic devices, high-speed memory devices, and how quickly signals can be transmitted from one circuit to another. Semiconductor technology to solve these problems has encountered more and more difficulties, because the switching speed of semiconductor devices and power consumption is proportional to increase the speed will inevitably increase power consumption; power consumption increases, not only brought cooling issues , And because of the inability to integrate at high density, the impact of signal propagation delays becomes significant.