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一、前言随着电子工业的发展,Al_2O_3陶瓷在电真空器件、集成电路封装管壳以及各种陶瓷基板等方面得到了广泛的应用。对于其中相当一部分产品来说,需要将瓷件与金属部件钎焊封接为一体。而陶瓷与金属是难以直接钎焊的,解决的办法是在钎焊之前先将陶瓷进行金属化。目前对Al_1O_3陶瓷一般采用的
I. Introduction With the development of the electronics industry, Al 2 O 3 ceramic has been widely used in electric vacuum devices, integrated circuit package tubes and various ceramic substrates. For a considerable part of the product, you need to braze the ceramic parts and metal parts together. The ceramic and metal is difficult to direct brazing, the solution is to braze the ceramic before the metal. Al_1O_3 ceramic currently used by the general