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为得到硅通孔电镀填充铜(TSV-Cu)的力学性能,对TSV-Cu进行了Berkovich纳米压痕实验.基于Oliver-Pharr算法和连续刚度法确定TSV-Cu的弹性模量和硬度分别为155.47 GPa和2.47 GPa;采用有限元数值模拟对纳米压痕加载过程进行反演分析,通过对比最大模拟载荷与最大实验载荷,确定TSV-Cu的特征应力和特征应变;由量纲函数确定的应变强化指数为0.4892;将上述实验结果代入幂强化模型中,确定TSV-Cu的屈服强度为47.91 MPa.最终确定了TSV-Cu的幂函数型弹塑性应力-应变关系.
In order to obtain the TSV-Cu mechanical properties, the TSV-Cu nano-indentation experiment was carried out.Based on the Oliver-Pharr algorithm and the continuous stiffness method, the elastic modulus and hardness of TSV-Cu were determined as 155.47 GPa and 2.47 GPa respectively. The inversion process of nano-indentation was simulated by finite element numerical simulation. The maximum stress and strain of TSV-Cu were determined by comparing the maximum simulated load with the maximum experimental load. The strain And the strengthening index is 0.4892.When the above experimental results are substituted into the exponentiation model, the yield strength of TSV-Cu is determined to be 47.91 MPa.The power-function elastic-plastic stress-strain relationship of TSV-Cu is finally determined.