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一、导言随着集成电路向大规模和超大规模发展,对管壳封装提出了特殊的要求。用以和外电路相连的外引线条数大大增加,甚至需要一百多条。而为了不致使内引线过长和管壳过大,引线间距将小到0.1毫米左右。另外,为了实现最后的全气密缝焊,与之相称的定位盖板是必不可少的。不难设想,如果采用模具机械冲制的办法要得到这种微细引线将是非常困难的。
I. INTRODUCTION With the development of integrated circuits to large-scale and ultra-large-scale development, special requirements have been put on package management. The number of external leads connected to the external circuit is greatly increased, even more than one hundred. In order not to cause the inner lead is too long and the shell is too large, lead spacing will be as small as 0.1 mm. In addition, in order to achieve the last all-air seam welding, the corresponding positioning of the cover is essential. It is not hard to imagine that it would be very difficult to obtain such a miniature lead using a die-mechanical punch.