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近年来无线通信在全球范围内得到了迅猛的发展 ,对收发无线信号的天线尺寸的小型化和性能要求也在日益增加。微带贴片天线以其卓越的性能 ,得到了广泛应用。传统的半波天线尺寸较大 ,在小型通信设备中使用会出现许多问题。本文提出了一种在高介电常数上用微机械工艺制作的短接层叠式贴片天线 ,该天线在硅片和接地板间夹一层Te flon(聚四氟乙烯 ) ,这样天线的性能得到了提升 ,相对带宽增加到 8.6 % ,而几何尺寸仅为波长的 1 8。天线的测试方向图表明 ,天线靠近手机电路板时 ,大部分的电磁辐射会远离使用者的头部 ,且波束宽度可保证足够大的覆盖范围。此天线是在硅片上进行微机械加工的 ,可与硅和GaAs集成电路集成在一起 ,而不会影响电路本身。此天线可适用于移动通信设备
In recent years, wireless communications have been rapidly developed worldwide, and the requirements for miniaturization and performance of antennas for transmitting and receiving wireless signals are also increasing. Microstrip patch antenna with its excellent performance, has been widely used. Traditional half-wave antennas are large in size and can cause many problems when used in small communication devices. In this paper, we propose a short-circuit laminated patch antenna made of micro-mechanical technology with a high dielectric constant. The antenna has a Teflon (Teflon) sandwiched between the silicon and the ground plane so that the performance of the antenna Has been improved, the relative bandwidth increased to 8.6%, while the geometric size of only the wavelength of 18. The test pattern of the antenna shows that most of the electromagnetic radiation is far away from the user’s head when the antenna is near the mobile phone circuit board, and the beam width ensures sufficient coverage. The antenna is micromachined on silicon and can be integrated with silicon and GaAs ICs without affecting the circuit itself. This antenna is suitable for mobile communication devices