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将微通道阵列移植到体导电基体可使微通道板(Microchannel Plate,MCP)免受离子反馈难题的困绕,而半导体玻璃可在不改变MCP的传统制作方法的基础上制作体导电MCP。一种特定组分的钒铁铅铝磷酸盐的半导体玻璃,采用与传统的还原铅硅酸盐玻璃MCP完全相同的制作方法,但不经过氢还原处理,制作成通道间距为12μm的25 mm直径的无实体边的MCP样品,这种半导体玻璃制作的MCP样品,在加载1 kV的恒稳态电压下,有稳定的微安级的传导电流和102量级的电流增益。本文对这种钒铁铅铝磷酸盐的半导体玻璃及其制作的体导电MCP样品的基本性能和表现进行了表征和分析,并讨论了进一步改进措施。
Transplantation of microchannel arrays to bulk conductive substrates can free Microchannel Plate (MCP) from the challenges of ion feedback, while semiconductor glass can be used to fabricate bulk conductive MCPs without changing the traditional fabrication methods of MCP. A specific composition of vanadium iron lead aluminum phosphate semiconductor glass, with the same reduction of lead-silicate glass MCP production methods, but without hydrogen reduction process, made into a channel pitch of 12μm 25 mm diameter Of solid-body-free MCP samples with a stable microampere-level conduction current and 102-order current gain at a steady-state voltage of 1 kV. In this paper, the basic performance and performance of the vanadium-iron-lead-aluminum phosphate semiconductor glass and the bulk conductive MCP samples fabricated by the method were characterized and analyzed, and further improvements were discussed.