一、前言在电器触点材料中,为了节约金、银等贵重金属,寻找复合材料作代用品的事例已逐渐增多和普遍。复合材料的界面结合情况直接影响使用寿命,对其研究就成为一个重要课题。本文探讨了我院研制的银-铜复合材料的金相技术,并对界而附近的显微组织进行了观察。 I. Introduction In the electrical contact materials, in order to save gold, silver and other precious metals, the search for composite materials as a substitute for the case has gradually increased and widespread. The interfacial bonding of composite materials has a direct impact on the service life, which has become an important issue for its research. This article explores the metallographic technique of the silver-copper composites developed in our institute and observes the microstructure near the boundary.