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在世界是孱产品制造产业中,各种形式的面阵封装仍在激剧增加。事实是,到1999年上半年为止,已有125个以上的先进封装方法专利得到了应用。它们大多数与芯片级封装(CSP)、球栅阵列(BGA)以及晶片级封装(WLP)有关。预计,从1993年算起,到1999年为止,七年间发布的面阵封装方法专利将超过800个,其中500个以上的专利是在最近的三年半内公布的。一份有关的最新报告对此作了研究,认为这些封装方法专利有助于使生产商在技术上保持最先进水
In the world 孱 product manufacturing industry, various forms of area array packaging is still increasing dramatically. The fact is that by the first half of 1999 more than 125 patents on advanced packaging methods had been applied. Most of them are related to chip scale packaging (CSP), ball grid array (BGA), and wafer level packaging (WLP). It is estimated that from 1993 onwards, there will be over 800 patents on surface-area packaging methods released in seven years till 1999, of which more than 500 patents have been announced in the recent three and a half years. A recent report of the relevant research, that these patented package method to help manufacturers keep the most technologically advanced water