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[期刊论文] 作者：Zhiheng Huang,Hua Xiong,Zhiyong Wu,Paul Conway,Hugh Davies,Alan Dinsdale,Yunfei En,Qingfeng Zeng,,
来源：Chinese Science Bulletin 年份：2014
Semiconductor technology and packaging is advancing rapidly toward system integration where the packaging is co-designed and co-manufactured along with the wafe...
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