铅锡基复合焊接接头相关硕士博士期刊学术论文 - 搜论网

铅锡基复合焊接接头相关论文

The influence of temperature enhanced SnPb based on creep behavior of Cu particle composite soldere

Creep property of solder alloys is one of the important factors to affect the reliability of soldered joints in SMT(surf......

期刊

铜颗粒增强铅锡基复合焊接接头温度蠕变行为 creep rupture life composite soldered joints particle-

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