【摘 要】
：
CMOS一MEMS and 3D integration are well recognized as the ultimate technology solutions forfurther miniaturized, low cost MEMS system IC manufacturing partic
【机 构】
：
SMIC,DirectorofMEMSand3D-ICTechnologyDevelopment
【出 处】
：
2011传感器与MEMS技术产业化国际研讨会
论文部分内容阅读
CMOS一MEMS and 3D integration are well recognized as the ultimate technology solutions forfurther miniaturized, low cost MEMS system IC manufacturing particularly to meet the ever stringenttechnical and economic requirements for smart phones, tablets and portable electronics as well asfuture wireless sensor network (WSN) applications. Under an expanded definition, the CMOS-MEMStechnology provides a series of silicon-based MEMS device fabrication technologies by leveraging quitebroad existing CMOS and/or CMOS compatible wafer processing toolset, capability and large scalemanufacturing infrastructure at low cost with high efficient and quality.
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