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The roadmap to drastically reduce manufacturing cost and increase the reliability of solid-state lighting devices (LEDs) is to make full use of the highly automatic and well-developed semiconductor integrated circuit (IC) manufacturing equipment and facilities for volume production.The technical challenge comes from the lattice and the thermal mismatches of III-V materials with the Si(100) substrates,a standard wafer substrate used in the IC industry.We have invented a powerful 3-dimensional (3D) LED with almost twice light-emission surface area,and a novel fabrication process that takes full-use of large scale Si(100) wafer through the legacy semiconductor IC manufacturing facility.3D LEDs have a comparable light emission efficacy with conventional LEDs from a standard sapphire substrate,but at a significant lower manufacturing cost and higher reliability.