面附元件的装焊技术

来源 :电子工艺技术 | 被引量 : 0次 | 上传用户:nosmallstar2
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三面附元件及其印制板结构随着电子设备不断向小型化、微型化方向发展,近来出现了各种各样的面附元件,由于面附元件装焊时不需要在印制板上钻大量的安装孔,元件直接贴在印制板铜箔走线表面上焊接,金属化孔只不过供走线之间的连接用,加上面附元件不存在引出线,分布电容小,对高频回路特别适用,因此近几年面附元件的应用越来越广泛.它改变了传统印制板的结构及其装焊工艺,国外将面附元件的开 Three-side attached components and PCB structure With the continuous miniaturization of electronic devices, miniaturization direction, the recent emergence of a variety of surface-attached components, surface-mounted components due to welding without the need to drill on the PCB A large number of mounting holes, components directly attached to the printed circuit board copper surface alignment, metalized holes only for the connection between the traces used, plus the surface attached components does not exist leads to the distribution of small capacitance, high frequency Circuit is particularly suitable, so in recent years, the use of surface attached components more widely.It changes the structure of the traditional PCB and its welding process, the foreign components will be attached to the surface of the open
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