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利用自行设计的超音速雾化制粉装置,研究了导液管突出高度对Sn3Ag2.8Cu无铅焊锡粉末有效雾化率、粒度分布、球形度及氧含量的影响。结果表明:在一定雾化条件下,导液管突出高度为4 mm,雾化粉末具有最佳球形度、表面光滑度及粒度分布,同时具有较高的有效雾化率和最低的氧含量;和Sn37Pb粉末相比,在与Cu基板的钎焊中,利用Sn3Ag2.8Cu粉末配制的焊锡膏与铜基板之间形成的IMC更厚,且更不规则;当导液管突出高度从4 mm增加至5 mm,粉末更细,有效雾化率提高,但粒度分布变差,粉末表面更粗糙;当导液管突出高度从4 mm减小至2 mm,粉末有效雾化率降低,粒度分布变差。因此,在本试验条件下,导液管突出高度最佳为4 mm。
The effect of the protruding height of the catheter on the effective atomization rate, particle size distribution, sphericity and oxygen content of Sn3Ag2.8Cu lead-free solder powder was studied by using a self-designed supersonic atomizing powdering device. The results show that under certain atomization condition, the protruding height of the catheter is 4 mm. The atomized powder has the best sphericity, surface smoothness and particle size distribution with high effective atomization rate and the lowest oxygen content. The IMC formed between the solder paste formulated with Sn3Ag2.8Cu powder and the copper substrate was thicker and irregular than the Sn37Pb powder in brazing with a Cu substrate; when the catheter protrusion height increased from 4 mm To 5 mm, the powder is finer and the effective atomization rate is increased, but the particle size distribution is worsened and the surface of the powder is rougher. When the projection height of the catheter is reduced from 4 mm to 2 mm, the effective atomization rate of the powder decreases, difference. Therefore, under the conditions of this test, the best catheter protruding height of 4 mm.