等离子体加工技术已成为半导体器件,尤其是LSI科研和生产中不可缺少的工艺,因而等离子体对半导体器件的影响已是人们十分关注的问题。等离子体对半导体表面的影响与一般射线辐射损伤的影响相比,情况要复杂得多。放在等离子体气氛中的半导体基片,要承受高能电子、光子及离子的轰击,轰击的结果,使半导 Plasma processing technology has become an indispensable technology in semiconductor devices, especially in the research and production of LSI. Therefore, the influence of plasma on semiconductor devices has become a major concern. The effect of plasma on the semiconductor surface is much more complicated than the effects of normal radiation damage. Semiconductor substrate placed in a plasma atmosphere, to withstand the bombardment of high-energy electrons, photons and ions, as a result of bombardment, the semiconductor