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为适应高密度、细微间距表面安装技术的需要,机电部十四所开展了多层印制电路板小孔金属化的工艺研究。在对理论进行了深入分析的基础上,采用了三步蚀刻工艺,保证了化学沉铜前孔壁清洁、光滑和恰当的凹蚀量,提高了多层印制板电路互连的可靠性。在孔金属化和电镀的全过程中,采取优化溶液配比、加速溶液在深孔中的流动等有效措施。使纵横比为6.6:1,难度系数13.3的φ0.3的小孔金属化获得了均匀可靠的镀铜层,各项技术指标达到国家军
In order to meet the needs of high-density, fine-pitch surface mount technology, MEP fourteen carried out multi-layer printed circuit board metal metallization process. Based on the deep analysis of the theory, a three-step etching process is adopted to ensure the clean, smooth and proper etching amount of hole wall before electroless copper immersion and improve the reliability of circuit interconnection of multilayer printed circuit board. In the whole process of hole metallization and electroplating, effective measures such as optimizing the solution ratio and accelerating the flow of the solution in the deep hole are taken. So that the aspect ratio of 6.6: 1, the degree of difficulty of 13.3 φ0.3 hole metallization obtained uniform and reliable copper plating layer, the technical indicators have reached the national army