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由于元件封装密度越来越大,电子系统的热失效正成为一个越来越困难的设计问题。本文介绍的是用有限元方法(FEM)对双列直插式(DIP)微电子封装中的稳态热传导进行的研究。虽然文章给封装设计专家提供了数据,但为了说明所使用方法的广泛适应性,也介绍了一些热传导的背景资料和有限元分析法。先后介绍了8脚和16脚DIP有限元模型的各级研究阶段。对一个先用自然对流然后用强制对流方法在空气中冷却的16脚DIP有限元模型进行了系统的热分析。通过FEM分析发现,封装中有一个复杂的三维热场。通过一功耗范围内的计算机运算,发现了温度分布和热阻随外部对流变化的规律。这项研究向用户提供了封装冷却的数据,同时着重强调了提供热阻标准定义存在的一些困难。
As component packaging density increases, the thermal failure of electronic systems is becoming an increasingly difficult design issue. This article describes the study of steady-state heat transfer in dual-in-line (DIP) microelectronic packages using the finite element method (FEM). Although the article provided data to package design specialists, some background information on thermal conduction and finite element analysis were introduced to illustrate the wide range of applicability of the methods used. The 8-foot and 16-foot DIP finite element models have been introduced at all stages of the research phase. A systematic thermal analysis was performed on a 16-foot DIP finite element model first cooled in air by natural convection and forced convection. FEM analysis shows that the package has a complex three-dimensional thermal field. Through the computer operation within a power range, the law of temperature distribution and thermal resistance with external convection was found out. The study provided users with data on package cooling, highlighting some of the difficulties in providing a standard definition of thermal resistance.