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高速逻辑线路的组装组装的分级高速逻辑线路的组装方法和从前一样,把大规模集成电路(LSI)和集成电路(IC)装在插件上,用插头座把这种插件和多层印制底板连接起来。但为了实现更高密度组装,所使用的插件板比从前用的多层印制线路板要大。表1列出组装的分级,照片1和图1及2示出插件和底板的组装方法。插件插件板由多层印制线路板构成,其尺寸约为230毫米×190毫米、厚度大约为1.6毫米。插件板共有
Assembly of High-Speed Logic Circuits Assembly The assembled high-speed logic circuits are assembled in the same way as before, with LSIs and integrated circuits (ICs) mounted on the card connectors, connect them. However, in order to achieve higher density assembly, the plug-in board used to be larger than the previous multi-layer printed circuit board. Table 1 shows the rating of the assembly, Photo 1 and Figures 1 and 2 show the method of assembling the insert and the backplane. Plug-in board consists of multi-layer printed circuit board, its size is about 230 mm × 190 mm, the thickness of about 1.6 mm. Plugin board