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主要探索采用双合金热等静压扩散连接工艺实现高温合金粉末和ＤＤ３单晶合金间可靠连接的可行性。研究内容包括热等静压（ＨＩＰ）扩散连接温度及热处理对ＦＧＨ９５—ＤＤ３复合界面的成分扩散、界面组织以及叶片材料本身组织性能的影响。研究表明，通过合理的工艺选择与改进，可以在保证对偶材料性能满足要求的前提下实现界面的良好扩散与结合。
The feasibility of reliable connection between high temperature alloy powder and DD3 single crystal alloy by dual hot isostatic pressing diffusion bonding process is explored. The effects of hot isostatic pressing (HIP) diffusion bonding temperature and heat treatment on the composition diffusion, interfacial microstructure and the microstructure and properties of the FGH95-DD3 composite interface were studied. The research shows that through reasonable process selection and improvement, the good diffusion and combination of interfaces can be achieved under the premise of meeting the requirements of dual material properties.