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笔者参加了1985年5月20～22日在美国华盛顿召开的第35届电子元件会议,并在会上宣读了题为“密封载体-多层厚膜基板微电子组装组件”的论文。本文结合会议情况介绍,分析一下微电子组装技术的发展动向,所见欠妥之处,敬请读者指正。会议论文共87篇(美国64篇,日本14篇,中国5篇,英国3篇,西德1篇)。绝大部分都是讨论微电子组装技术问题,计有高速度、高密度组装、表面安装、芯片载体-基板组件、针阵列封装、芯片键合与载体焊接、有机包封、连接器、可靠性、厚薄膜技术、电子材料、组容元件和CAD/CAM/CAT等内容。
The author attended the 35th session of the Electronic Components Conference held in Washington, May 20-22, 1985 and presented a paper entitled “Sealed Carrier - Multilayer Thick Film Substrate Microelectronic Assembly Components”. In this paper, the meeting introduced the situation, analysis of the development trend of microelectronics assembly technology, see the defects, please correct me. A total of 87 conference papers (64 in the United States, Japan 14, China 5, Britain 3, West Germany 1). Most of the discussions are about microelectronics assembly technology, including high speed, high density assembly, surface mount, chip carrier - substrate assembly, pin array, chip bonding and carrier soldering, organic encapsulation, connectors, reliability , Thick film technology, electronic materials, component content and components such as CAD / CAM / CAT and so on.