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BGA器件首先经历2 000 h的温循老化以接近废旧状态,再以自重跌落,然后用锡膏印刷的方法完成焊锡球的修复,最后利用Dage4000测试机对不同状态的器件进行焊锡球推拉力测试。结果发现,随着温循老化的时间增加,失效模式逐渐由韧性失效主导转向脆性失效主导。当焊锡球被修复后,失效模式变为混合模式。通过强度对比可以发现,器件的焊接强度随着温循老化时间的增加而降低。当焊锡球被修复后,焊接强度可以恢复到初始状态的80%左右。修复的焊锡球产生的再生金属间化合物可能是造成焊接强度变化的主要原因。
The BGA device first undergoes warm aging of 2 000 h to get close to the waste state, falls down by its own weight, and then repairs the solder ball by the solder paste printing method. Finally, the Dage4000 testing machine is used to perform the solder ball pushing pull test on devices with different states . The results showed that with the increase of aging temperature, the failure mode gradually led from ductile failure to brittle failure. When the solder ball is repaired, the failure mode changes to the mixed mode. By comparing the intensity, we can find that the welding strength of the device decreases with the increase of the aging time of the temperature. When the solder ball is repaired, the weld strength can be restored to about 80% of the initial state. Regenerative intermetallics produced by repaired solder balls may be the main cause of changes in weld strength.