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本文论述了静电封接技术的基本原理及其在半导体压力传感器生产中的应用.主要介绍一种简单而廉价的静电封接装置及操作工艺和一些实验结果.这种封接技术不用其它任何粘合剂,将硅与玻璃相接触进行静电封接,形成的硅-玻璃组合体是一种刚性结构.封接时所选用的玻璃的热膨胀系数应与硅的热膨胀系数相接近(Si:2.5×10~(-6)/ k,~#7740 Pyrex glass:3.25×10~(-6)/k),例如:九五料玻璃,派雷克斯玻璃均能获得好的封接效果.静电封接技术的特点是:芯片反刻铝引线不会被氧化(封接时温度在400℃左右),封接牢固、迅速、气密性好,不产生蠕变,能耐高温,耐潮湿,稳定性好.
This article discusses the basic principles of electrostatic sealing technology and its application in the manufacture of semiconductor pressure sensors.A simple and inexpensive electrostatic sealing device and operating techniques and some experimental results are introduced.This sealing technology without any other sticky , The silicon-glass composite is a rigid structure, the thermal expansion coefficient of the selected glass should be close to the thermal expansion coefficient of silicon (Si: 2.5 × 10 -6 / k, ~ # 7740 Pyrex glass: 3.25 × 10 -6 / k), for example: Ninety-five material glass, Pyrex glass can get good sealing effect. The technology is characterized by: the chip anti-lead aluminum wire will not be oxidized (sealing temperature of about 400 ℃), sealing solid, rapid, tightness, no creep, high temperature, humidity resistance, stability it is good.