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针对大型计算机服务器CPU的热控制,对三种不同热管排布方式进行了热扩散特性实验研究和计算。其中包括:CPU热扩散板冷却温度的比较、散热器总热阻的计算分析以及热扩散板与散热器底板的最优面积比等。实验研究表明:采用非对称U型和“工”型热管散热器,在最大热流密度为74.3W/cm~2时可以保证芯片正常工作;热管合理的排布以及设计热扩散板与热管散热器底板的最佳面积比可以有效改善散热器底板材质的导热性能。研究结果对于大型计算机服务器芯片的热控制提供科学的理论依据。
Aiming at the thermal control of large computer server CPU, the thermal diffusivity characteristics of three different heat pipe arrangements were experimentally studied and calculated. Including: CPU thermal diffuser cooling temperature comparison, the total heat sink calculation and analysis of the thermal diffuser and the radiator floor optimal area ratio and so on. Experimental results show that: the use of asymmetric U-shaped and “工 ” type heat pipe radiator, the maximum heat flux of 74.3W / cm ~ 2 can ensure the normal operation of the chip; heat pipe reasonable arrangement and design thermal diffuser and heat pipe The optimal area ratio of the radiator base plate can effectively improve the thermal conductivity of the radiator base material. The results provide a scientific theoretical basis for the thermal control of large computer server chips.