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高速数据传输有其实际上的经济效益,新一代电信及数据通信产品需要传送大量数据,因此在这两股力量的带动下,高速底板的系统设计工程师纷纷尝试利用新技术,以便为高速传输系统提供支持。不少高速传输系统,尤其是第三代（3G）基站、数字交叉连接、可串联的以太网交换器,以及添加/删除（add—drop）多路转换器等方面的应用方案,都采用低电压差分信号传输（LVDS）技术。过去五年来,基于LVDS的互连技术无论在速度、整体有效载荷还是技术集成度等方面都有飞跃发展。20世纪90年代中期,分立组件在设计上一般只容许在短距离（不超过5米的电缆或印刷电路板）内进行高达300Mbps的传
High-speed data transmission has its actual economic benefits. A new generation of telecom and data communication products need to transmit large amounts of data. Therefore, driven by these two forces, system design engineers of high-speed backplanes have tried to utilize new technologies to provide high-speed transmission systems provide support. Many high-speed transmission systems, especially third-generation (3G) base stations, digital cross-connect, connectable Ethernet switches, and add-drop multiplexers and other applications, Voltage Differential Signaling (LVDS) technology. Over the past five years, LVDS-based interconnect technologies have seen rapid growth in terms of speed, total payload, and technology integration. In the mid-1990s, discrete components were generally designed to only allow transmissions up to 300 Mbps over short distances (cables or printed circuit boards up to 5 meters in length)