三菱电机公司的生产技术研究所,借助激光电镀法用金进行图样宽100μm以下、析出速度1μm/s厚的高精度、高速无掩模局部电镀获得成功。激光电镀是对浸渍在电解液中的阴极照射激光,从而仅在被照射部分得到析出的新电镀法。由于无掩模,故能对软性图样电镀,并能利用底片般的底图将 Mitsubishi Electric Corporation’s production technology research institute, by laser plating with gold pattern width of 100μm, the deposition rate of 1μm / s thick high-precision, high-speed maskless local plating success. Laser plating is a new plating method that irradiates a cathode immersed in an electrolytic solution with a laser to precipitate only in the irradiated portion. Since there is no mask, it can be soft pattern plating, and can use the negative film like the map will be