塑料封装是生产塑封晶体管的关键工艺装备。各技术先进国家已普遍使用。本成果研制的电子塑料封装模是一种多型腔 ,高精度的大型模具。生产效率高、工艺简便 ,可大量连续生产、成本低 ,器件质量高、刚度大 ,模具承载部位在空腔处有刚度较大的支柱 ,且分布密度较大 ,模具型腔均 Plastic packaging is the production of plastic transistors, the key process equipment. All countries with advanced technologies have been widely used. The results of the development of electronic plastic package mold is a multi-cavity, high-precision large mold. The invention has the advantages of high production efficiency, simple process, continuous production in large quantities, low cost, high device quality, high rigidity, strong rigidity at the cavity of the die bearing part and large distribution density,