本文介绍用激光全息干涉法检测印刷电路板上焊点的原理和方法。由于焊点在适当的热加载后,其残余热应变会引起有缺陷焊点条纹畸变,从而判断焊点的好坏。同时介绍了检测和解剖结果以及几种缺陷焊点检测的成功率。本方法对印刷电路板安装工艺的一致性要求不严格,原则上不需要样板作比较,对小批量或单件生产的印刷电路板检测也同样适用。 This article describes the principle and method of laser holographic interferometry for the inspection of solder bumps on printed circuit boards. As the solder joints in the appropriate heat load, the residual thermal strain will cause defective solder joint fringe distortion, to determine the quality of solder joints. At the same time, the detection and anatomical results as well as the success rate of several defects solder joint detection are introduced. This method of PCB assembly process is not stringent requirements of consistency, in principle, do not need a model for comparison, the small batch or single production of printed circuit board testing also applies.