前言如果把群焊的定义看成是集成电路芯片和组合件(Package)同时进行连接的一种技术,那么这当中就包含着倒装法,梁式引线焊接及以往曾提过的其他一些焊接方法。这些焊接方法是以改善引线焊接的效率及可靠性为目的研制出来的,实际上,仅倒装法中的一部分方式和梁式引线法在有限的方 Introduction If you think of the definition of group welding as a technique for simultaneous connection of an integrated circuit chip and a package, there are flip-chip, beam-lead, and other previously mentioned solders method. These soldering methods have been developed for the purpose of improving the efficiency and reliability of wire bonding. In fact, only a part of the flip-chip method and the beam lead method are limited in a limited number of ways