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本文研究了用聚乙二醇化合物作添加剂的化学镀铜液动力学。铜离子,氢氧根离子和甲醛的浓度可以变化。讨论了聚乙二醇化合物对金属表面的影响。新的化合物聚乙二醇硫醚已经制备出来并已在化学镀铜液中使用。这些新型化合物在一个分子中既含有对镀液起稳定作用的带硫的基团,又含有能提高镀率从而获得较好铜层质量的聚乙二醇基团。通过在化学镀铜液中添加含有各种数量的聚乙二醇基团来比较聚乙二醇和聚乙二醇碗醚化合物浓度的作用。
This paper studies the electroless copper plating fluid dynamics with polyethylene glycol compounds as additives. The concentration of copper ions, hydroxide ions and formaldehyde can vary. The effect of polyethylene glycol compounds on the metal surface is discussed. New compound polyethylene glycol thioether has been prepared and has been used in electroless copper plating solution. These new compounds contain, in one molecule, both sulfur-bearing groups that stabilize the bath and polyethylene glycol groups that increase the plating rate for better copper layer quality. The effect of comparing the concentrations of polyethylene glycol and polyethylene glycol bowl ether compounds by adding various amounts of polyethylene glycol groups to the electroless copper plating solution was investigated.