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均热板作为一种新型的高效散热技术,具有热导率高、均温性良好等优点,越来越多地应用于机载电子设备。文中介绍了均热板散热原理,针对均热板和相同尺寸电子设备模块壳体在不同工况下进行散热性能实验研究,对比测试了两者均温效果和散热效果。测试结果表明,均热板的均温效果优于同尺寸常规铝材模块壳体;功耗及热流密度越大,均热板散热优势越明显;采用不同散热方式,均热板内芯片与模块壳体内芯片的温差相同;多芯片时,总功耗越高芯片表面温度越高,芯片热流密度越集中,芯片表面温度越高。当达到散热极限时,应设计为多芯片,低热流密度的形式,均热板可以达到更好的散热效果。
As a new type of high efficiency heat sink technology, the heat sink has the advantages of high thermal conductivity and good temperature uniformity, and is increasingly used in airborne electronic equipment. In this paper, the principle of heat dissipation of soaking plate is introduced. According to the experiment of heat dissipation performance of heat sink and shell of same size electronic equipment under different working conditions, the average temperature effect and heat dissipation effect are compared and tested. The test results show that the average temperature effect of the soaking plate is better than that of the conventional aluminum module casing of the same size. The greater the power consumption and heat flux density, the more obvious the advantages of the soaking plate are. With different heat dissipation methods, The temperature difference between the chips in the shell is the same. When the chip is multi-chip, the higher the total power consumption is, the higher the chip surface temperature is. The more the chip heat flux density is concentrated, the higher the chip surface temperature is. When reaching the heat dissipation limit, should be designed for multi-chip, low heat flux density form, the heat plate can achieve better heat dissipation.