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法国国家电信研究中心和汤姆逊公司共同建设的最现代化的半导体生产工厂最近在格勒诺布尔附近的克罗尔落成。这既是一个研究中心又是一个生产基地,其潜在的月生产能力为以0.5微米的CMOS(互补金属氧化物半导体)工艺制作的、包括200个直径为200毫米的大体积集成块的薄片20000个。这是西方国家中最先进最现代化的工厂。 这个工厂能制造几种不同的产品,由于设计先进,有的产品可以在6种不同的刻蚀工艺中选择一种制作。范围可以从0.7微米和1.2微米的BICMOS(双结型互补金属氧化物半导体)到0.5微米或0.7微米的三层金属互连的CMOS。该工厂下一代产品是0.35微米的CMOS,计划于1996年投入生产。 为了工厂的进一步发展,该研究与生产基地在设计时就考虑到车间应具备0.2微米生产工艺的能力。其无尘(超净)生产区域目前的面积为2000平方米,
The most modern semiconductor manufacturing facility jointly built by the French National Telecommunication Research Center and Thomson Corporation was recently completed in Kroll near Grenoble. This is both a research center and a production base, and its potential monthly production capacity is 20,000 sheets of 200 large-diameter, 200-mm-diameter masses fabricated in a 0.5-micron CMOS (Complementary Metal Oxide Semiconductor) process. . This is the most advanced and modern factory in the Western countries. This factory can produce several different products. Due to advanced design, some products can be selected among 6 different etching processes. The range can range from 0.7 micron and 1.2 micron BICMOS (double junction complementary metal oxide semiconductor) to 0.5 micron or 0.7 micron three-layer metal interconnect CMOS. The next generation of the plant is 0.35-micron CMOS and is scheduled to go into production in 1996. For the further development of the plant, the research and production site was designed with the ability to have a 0.2 micron production process. Its dust-free (ultra-clean) production area currently has an area of 2,000 square meters.