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在电流密度50 mA/cm~2,温度40℃下,通过电位测定,化学分析、X射线衍射和扫描式电子显微镜(SEM)观察,研究了在硫酸溶液中Pb—Ag二元合金和Pb—Ag—Ca三元合金阳极的行为。这些合金阳极的行为受显微组织和含银量的影响很大。合金中银的合金化可以抑制阳极氧化,降低阳极电位生成致密的紧紧粘结到电极上的氧化层,并在阳极氧化层中出现p—PbO_2。在许多缓慢固化的Pb—Ag合金阳极中,由于原生相颗粒周围是富银次生相,所以在低含银条件下,银台金化的影响比单相的被银过饱和的迅速固化的二元合金要明显。
The effects of Pb-Ag binary alloy and Pb-Ag alloy in sulfuric acid solution were investigated by potentiometry, chemical analysis, X-ray diffraction and scanning electron microscopy (SEM) at a current density of 50 mA / cm ~ Ag-Ca ternary alloy anode behavior. The behavior of these alloy anodes is strongly influenced by the microstructure and the amount of silver contained. Alloy alloying of silver can inhibit anodic oxidation, reduce the anode potential to produce a dense tightly bonded to the oxide layer on the electrode, and in the anodized layer of p-PbO_2. In many slow-curing Pb-Ag alloy anodes, since the primary phase particles are surrounded by silver-rich secondary phases, the effect of silver-gold plating is lower than that of single-phase silver over-saturated rapidly curing Binary alloy to be obvious.