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英特尔公司今天宣布启动直径为300毫米(12英寸)硅晶片开发项目。和传统的直径为200毫米(8英寸)的晶片相比,新的晶片的表面积将增大一倍多。与200毫米的硅晶片相
Intel Corporation today announced the launch of a 300-mm (12-inch) silicon wafer development project. The surface area of the new wafer will more than double compared to a conventional wafer with a diameter of 200 mm (8 inches). Compared with 200 mm silicon wafers