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一、前言线路板焊点的质量直接影响到电子设备的工作可靠性,因此受到极大的重视。目前生产上靠检验人员观察焊点表面特征来判断其质量,但是无法精确判明内部结合质量。尤其在生产试制、变换元器件、变换焊料和助焊剂、以及改变工艺方法和参数的时候,必须有更可靠的质量分析方法。光学金相及新近发展的扫描电镜金相是检查焊点质量的有效方法。我们用这两种方法研究了电视机线路板焊点生产的几种工艺因素对焊点质量的影响,并且提出了推广应用的意见。
First, the preface Solder joint circuit board quality directly affects the reliability of electronic equipment, it received great attention. At present the production of inspectors observe the surface characteristics of solder joints to judge its quality, but can not accurately determine the quality of the internal bond. In particular, there is a need for more reliable methods of quality analysis when manufacturing prototypes, changing components, changing solders and fluxes, and changing process methods and parameters. Optical metallography and the newly developed scanning electron microscopy is an effective way to check the quality of solder joints. We use these two methods to study the impact of several process factors on the quality of solder joints produced by the production of TV circuit board solder joints, and put forward the views of popularization and application.