玻璃和塑料是集成电路封装最早采用的材料,因为它们制造方便且比其他材料成本低。当要求升高温度和全密封时,仅玻璃封装就能满足。但是玻璃封装也有它的不足之处,如抗机械应力和热冲击能力差等。为了获得一种更为合适的封装,大约五年前就认真地开始了集成电路用的高氧化铝陶瓷封装的生产。 Glass and plastic are the earliest materials used in IC packaging because they are easy to manufacture and less expensive than other materials. When asked to raise the temperature and seal, only the glass package will be able to meet. However, glass packaging also has its disadvantages, such as resistance to mechanical stress and thermal shock and poor. In order to obtain a more suitable package, the production of high alumina ceramic packages for integrated circuits began earnestly about five years ago.