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采用数值分析和试验研究方法考察了焊点间距对两种胶焊中应力应变分布和接头强度的影响。结果表明,高弹性模量胶粘剂胶焊接头中,增大焊点间距,焊点区应力减小而搭接区边缘胶层中的应力应变略有增大;低弹性模量胶粘剂胶焊接头中,焊点处应力集中程度和搭接区边缘胶层中的剪应变值都随焊点间距的增加而增大,增加焊点间距,两种接头的胶层断裂强度都将降低。试验所得接头断裂时的名义应力随焊点间距的增加而略有减小,与计算结果吻合良好。
The effects of welding spot spacing on stress-strain distribution and joint strength in two kinds of glue welding were investigated by numerical analysis and experimental research. The results show that in the high elastic modulus adhesive glue joint, the solder joint spacing is increased, the stress in the solder joint zone is reduced and the stress and strain in the adhesive layer at the edge of the overlap zone is slightly increased. In the low-modulus adhesive glue joint , The degree of stress concentration at the solder joints and the shear strain value in the adhesive layer at the edge of the overlap zone both increase with the increase of the solder joint spacing and increase the solder joint spacing and the breaking strength of the two joints will be reduced. The nominal stress at break of the test joint slightly decreases with the increase of the solder joint spacing, which is in good agreement with the calculated result.