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Molecular simulations using MEAM(Modified Embedded Atom Method) potentials have been applied to research the interfacial properties of the different(hkl) Cu substrate in the soldering.In the simulation,the surface energies and the process of Sn spreading on the different(hkl) copper plate surface were simulated,and the results show that the different(hkl) plane substrates have few effects to the soldering spreading process,the solid-liquid interfacial energy is still the dominant ingredient practically in the wetting process.
Molecular simulations using MEAM (Modified Embedded Atom Method) potentials have been applied to research the interfacial properties of the different (hkl) Cu substrate in the soldering.In the simulation, the surface energies and the process of Sn spreading on the different (hkl) copper plate surface were simulated, and the results show that the different (hkl) plane substrates have few effects to the soldering spreading process, the solid-liquid interfacial energy is still the dominant ingredient practically in the wetting process.