论文部分内容阅读
介绍了电子元器件可焊性试验的不同方法,重点分析了润湿称量法评定电子元器件可焊性的优越性和准确性,并对如何准确有效评定电子元器件的可焊性试验方法的条件、原则和应注意的问题作了阐述。
The different methods of solderability test for electronic components are introduced. The advantages and the accuracy of wetting weighing method for assessing the solderability of electronic components are analyzed emphatically. And how to evaluate the solderability of electronic components accurately and effectively The conditions, principles and problems should be noted.