论文部分内容阅读
2月5日,高通 CDMA 技术公司宣布推出支持 SIM 卡的3G CDMA 芯片组解决方案——MSM5105,以满足中国和韩国手机厂商生产全球漫游手机的需要。这是全球首款集成了R-UIM(SIM)卡技术的3G cdma2000 1x芯片解决方案。高通 CDMA 技术公司已于2000年12月推出了 MSM5105芯片组和系统软件,该解决方案与斯伦贝榭公司2000年6月宣布的支持3G CDMA Simera Airflex 智能卡具有直接接门。高通同时宣布按时向授权客户交付高通 CDMA 技术公司的
On February 5, Qualcomm CDMA Technologies announced the launch of its CDMA 3GM chipset solution - SIMM5105 - to meet the needs of handset manufacturers in China and South Korea for global roaming. This is the world’s first 3G cdma2000 1x chip solution with integrated R-UIM (SIM) card technology. Qualcomm CDMA Technologies Inc. introduced the MSM5105 chipset and system software in December 2000 with direct access to Schlumberger products announced in June 2000 for supporting 3G CDMA Simera Airflex smart cards. Qualcomm also announced the delivery of QUALCOMM’s CDMA technology to authorized customers on time