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a.首先,焊接之前应在印制电路板上涂上助焊剂,以免印制电路板铜箔吃锡不良或表面氧化而造成不易焊接,集成电路一般不需涂助焊剂。用镊子仔细地将芯片引脚与印制电路板的焊盘对齐,注意其放置方向应正确。把烙铁的温度调到250℃左右,将烙铁头沾上少量的焊锡,用镊子向下按住已对准位置的芯片,在其对角位置的引脚上,加少量助焊剂,迅速焊接这两只引脚,将芯片固定。再次检查芯片的位置是否对准,如有必要可进行调整或拆除并重新对准。在焊接芯片其余引脚时,一只手持烙铁给集成电路引脚加热,另一只手将焊锡丝送往加热引脚焊接,直
a. Firstly, flux should be applied on the printed circuit board prior to soldering to avoid poor soldering due to poor or surface oxidation of the printed circuit board copper foil. The integrated circuit generally does not need to be coated with flux. Use tweezers to carefully align the chip pins with the solder pads on the printed circuit board, taking care that the placement should be done correctly. The temperature of the iron transferred to about 250 ℃, the tip with a small amount of solder stained with tweezers down the chip has been aligned at the diagonal position of the pin, add a small amount of flux, rapid welding this Two pins, the chip fixed. Check again for alignment of the chip and adjust or remove and realign if necessary. While soldering the remaining pins of the chip, one hand holds a soldering iron to heat the IC pins, the other hand sends the solder wire to the heated pin for soldering