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众所周知,当半导体器件处于间歇工作状态时,器件经历周期性高温、低温循环,形成了热循环.该热循环在器件内部产生应力,并在热循环过程中反复不断地作用在器件内部的接合层上,使器件的热阻增加,最后导致器件热疲劳失效.热疲劳失效是影响功率器件可靠性的重要因素.因此,开展间歇工作寿命试验(即疲劳试验),考核器件在间歇工作状态下
It is well-known that when the semiconductor device is in an intermittent operating state, the device undergoes periodic high temperature and low temperature cycles to form a thermal cycle that generates stress in the device and repeatedly acts on the bonding layer inside the device during thermal cycling , So that the thermal resistance of the device increases, and finally lead to thermal fatigue failure device thermal fatigue failure is an important factor affecting the reliability of power devices.Therefore, to carry out intermittent working life test (fatigue test), the assessment device in the intermittent working condition