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采用硬度检测、透射电镜观察、选区电子衍射等方法,研究了Al-Cu合金固溶态、含θ′相和含θ相的试样在强变形诱导析出相低温回溶后的加热退火过程中晶粒尺寸、高角晶界百分比及组织结构和硬度的变化。试验结果显示:当退火温度低于150℃时,Al-Cu合金三种状态的试样其晶粒尺寸与高角晶界的百分数基本上没有变化;加热温度至200℃以上后,晶粒尺寸、高角晶界百分比开始增加;加热至250℃时,固溶态试样的晶粒尺寸长大至100μm左右,含析出相的试样晶粒尺寸保持在10.0～15.0μm。在250℃退火50min后,固溶态试样的硬度值一直低于含θ′、θ析出相试样的硬度值。
The hardness and transmission electron microscopy, selected area electron diffraction and other methods were used to study the thermal annealing process of solid solution, θ ’phase and θ phase in Al-Cu alloy after low temperature Grain size, percentage of high-angle grain boundaries and changes in microstructure and hardness. The results show that when the annealing temperature is lower than 150 ℃, the grain size and the percentage of high-angle grain boundaries of Al-Cu alloy have almost no change. When the temperature is over 200 ℃, the grain size, The percentage of high-angle grain boundaries began to increase. When heated to 250 ℃, the grain size of solid-solution samples grew up to about 100μm, and the grain size of the sample containing precipitates remained at 10.0-15.0μm. After annealed at 250 ℃ for 50min, the hardness of the solid-solution sample is always lower than the hardness value of the sample containing θ ’and θ precipitates.