等离子加工技术在半导体器件制造中广泛用于有机材料和无机材料的淀积和蚀刻。这些技术能精确地控制尺寸并能实现远小于1微米的结构的微细加工。 显然,这些技术在压力/应力计,热成象系统和声表面波(SAW)器件等传感器的制造中潜力也是很大的。本文将比较详细地讨论干法加工在上述某些领域中的应用。推动这一技术发展的原因也许是有可能制成单片集成的传感器、检测器及有源器件等等,这将使这些器件的价格大为降低。 Plasma processing techniques are widely used in the fabrication of semiconductor devices for the deposition and etching of organic and inorganic materials. These techniques accurately control the size and enable microfabrication of structures much smaller than 1 micron. Obviously, these technologies have great potential in the manufacture of sensors such as pressure / strain gauges, thermal imaging systems and surface acoustic wave (SAW) devices. This article discusses the use of dry machining in some of these areas in more detail. Perhaps the reason for the advancement of this technology is the possibility of making monolithically integrated sensors, detectors and active devices, which will result in a much lower price for these devices.