论文部分内容阅读
本文比较了金属和硅两种场发射阴极的优缺点，研究了将两者优点结合在一起的金属涂敷硅阴极的制造工艺，比较了电镀法和溅射法制备的金属涂层对硅的附着力；采用先溅射后电镀的两步工艺制作出了较为理想的包全硅尖阵列。
In this paper, the advantages and disadvantages of both metal and silicon field emission cathodes are compared. The manufacturing process of the metal-coated silicon cathode combining the advantages of the two is studied. The effects of the metal coating prepared by electroplating and sputtering on the silicon Adhesion; the use of the first sputtering after plating two-step process to make a more ideal package all-silicon tip array.